The updated version of the Leica EM TIC 3X is based on our motto ‘with the user for the user’ in combining performance and flexibility in a practically-relevant way.
The doubled milling rate of the latest EM TIC 3X can be further enhanced with the option of five different stages adapted to your application requirements.
The Triple Ion Beam Milling System, Leica EM TIC 3X allows production of cross sections and planed surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations.
With the Leica EM TIC 3X you achieve high quality surfaces of almost any material at room temperature or cryo, revealing the internal structures of the sample in a near native state as possible.
The flexible choice of stages makes the Leica EM TIC 3X a perfect instrument not only for high through-put but also for contract laboratories. Depending on your needs the Leica EM TIC 3X can be configured individually using interchangeable stages for applications of standard preparation, high throughput processing, as well as the preparation of extremely heat sensitive samples such as polymers, rubbers or biological materials at low temperatures.